energy dispersive x-ray spectrometer meaning in Chinese
能量扩散
能量色散x射线分光计
能散x射线谱仪
Examples
- Microbeam analysis - instrumental specification for energy dispersive x - ray spectrometers with semiconductor detectors
微光束分析.带半导体探测器的能量散射x射线光谱仪的仪器规范 - Test method for energy dispersive x - ray spectrometer analysis of metallic surface condition for gas distribution system components
气体分配系统元部件用金属表面状态的能量分散x射线分光光谱分析试验法 - The commonly seen gold - carrying minerals in hard - to - leach gold ores - pyrite and arsonpyrite were used in the experiment . through sweep electron microscope ( sem ) and energy dispersive x - ray spectrometer ( edx ) , the change law of the shape and appearance characteristics of the gold - carrying minerals under the mechanical activation function of drum grinding and other activation function were studied so as to provide a reliable basis for the study on the mechanism of the effect of mechanical activiation on the intensification of leaching process
采用难浸金矿常见的载金矿物? ?黄铁矿和毒砂做试验，通过扫描电镜( sem )和x射线能谱仪( edx )研究了在滚筒磨的机械活化作用和不同的活化条件下载金矿物形貌特征的变化规律，为弄清机械活化作用强化浸出过程的机理提供了可靠的研究依据。 - A reliability experiment of thermal aging was carried out for the two types of joints , scanning electron microscopy , energy dispersive x - ray spectrometer and micro x - ray diffractomer were adopted to investigate the interfacial evolution behavior of joints , and kinetics model of imc formation was established . the results show that imc growth follows the parabolic law as a function of aging time at certain aging temperature , imc growth is more sensitive to the aging temperature than the aging time , the activation energy of cu - al imc growth is 97 . 1kj / mol and the major forming cu - al imc are cual2 and cu9al4 , the activation energy of au - al imc growth is 40 . 1kj / mol and the main au - al imc are au4al and au5al2 , with au2al and aual at the interfacial periphery of joints , the rate of cu - al imc growth is about 1000 times slower than that of au - al imc , and kirkendall voids and cracks are easily appeared during thermal aging in gold ball bonds while voids and cracks are absent in copper ball bonds even after aging at 200 for 2900 hours and 250 for 169 hours
研究结果表明:金属间化合物厚度与老化时间的关系符合抛物线法则,金属间化合物的生长对老化温度比老化时间更加敏感; cu - al金属间化合物生长的激活能为97 . 1kj / mol ,老化后金属间化合物呈层状分布,主要相为cual2和cu9al4 ; au - al金属间化合物生长的激活能为40 . 1kj / mol ,主要相为au4al和au5al2 ,同时在界面周边区域生成了au2al和aual ;老化过程中cu - al金属间化合物生长速率比au - al金属间化合物生长速率小103数量级;金丝球键合点200老化96小时出现了明显的kirkendall空洞和裂纹,但铜丝球键合点200老化2900小时和250老化169小时都没有形成空洞和裂纹。